Title: Robotics and AI for the inspection of large infrastructures

Abstract: This presentation reviews the progress made by the INTER research group in the inspection of large infrastructures, with a particular focus on the inspection of large-tonnage ships. Among others, the INTER group research activity includes the development of a comprehensive framework, supported by unmanned aerial vehicles, for the assisted collection of inspection data. The framework integrates autonomous robot operation, inspection data acquisition, three-dimensional reconstruction, and artificial intelligence-based defect detection and localization. The framework has been experimentally validated through field trials conducted aboard real merchant vessels within the scope of several EU-funded R+D projects.

Short Biography:

Alberto Ortiz is the leader of the INTER (INTelligent Embedded systems and Robotics) research group at the University of the Balearic Islands. He is also member of the Department of Mathematics and Computer Science at the same university, where he serves as full professor. He has led a number of R+D projects funded by the Local Government, by the Spanish Government and by the European Comission, all of them mostly dealing with mobile robotics, computer vision/image processing and machine learning. He is author and co-author of more than 190 publications on the previous topics, including peer-reviewed conference communications and journal papers. He regularly serves as reviewer and member of the scientific/organization committees for a number of Spanish and international conferences and journals in the same areas. He is as well member of the IEEE Robotics and Automation Society (RAS), the IEEE Computational Intelligence Society (CIS) and also the International Association for Pattern Recognition (IAPR).

Title: TBD

Abstract: This presentation reviews the MicroNano Spain project, which is the name of the Spanish Competence Center in microelectronics, cofunded by the EU and the Spanish government. The talk will also cover the latest advances on the European Chip Act 2.0.

Short Biography:

Alfonso Gabarrón is the General Manager of AESEMI, the Spanish Semiconductor Industry Association. With a background in telecommunications engineering and law, he has spent more than a decade working with institutions and companies, having held positions in sectors such as strategic consulting and public affairs, as well as on governing bodies at universities and within public administrations. In addition, Alfonso collaborates with other organizations, serving as a member of the Technological Transformations Working Group at the Elcano Royal Institute, Spain’s leading think tank, and the Microelectronics Working Group of the Official Association of Telecommunications Engineers.

Title: “Challenges and Solutions in Building AI Data Centers: A Component-Level Perspective”

Abstract

In today’s AI era, global semiconductor sales are projected to reach ≈ 1 trillion € by 2030 and AI investment is accelerating across the industry. This presentation shows how Rohde & Schwarz helps data‑center operators meet the resulting power, connectivity, and resilience challenges.

• Power & efficiency – Precise measurement of transformers, UPS, PDUs and server PSUs (oscilloscopes, power analyzers) together with EMC compliance and component‑level characterization (VNAs, SMUs, LCR meters) enables energy‑optimal designs.
• Connectivity – Signal‑integrity and clock‑distribution testing (VNAs, signal generators, phase‑noise analyzers) guarantee that high‑speed links (PCIe, Ethernet, memory) meet shrinking jitter budgets, while power‑integrity checks ensure reliable delivery.
• Resilience – Millimeter‑wave body scanners and counter‑drone solutions protect the perimeter; firewalls, network encryptors and deep‑packet inspection secure the IT layer; spectrum‑analysis tools support zoning and EMI/EMS compliance.

By weaving these measurement‑driven capabilities together, the presentation demonstrates how R&S enables customers to accelerate AI deployment, maximize energy efficiency, and maintain robust security throughout the data‑center ecosystem.

Short Biography:

Christian Dille earned his M.Sc. in Physics (specializing in ultra‑fast laser photonics) from the Friedrich‑Schiller University Jena in 2006. After several years working in the photonics industry, he joined Rohde & Schwarz in 2019 as Market Segment Manager – Research and Universities. In this role he partners with customers in academia to deliver end‑to‑end measurement solutions that address today’s most demanding research challenges, e.g., in quantum‑technology research, advanced material characterization, and particle‑physics instrumentation.

Title: TBD

Short Biography:

Ronald Tetzlaff is the Chief Officer for Technology Transfer and Internationalisation and head of the chair of Fundamentals of Electrical Engineering at the Technische Universität Dresden, Germany.

He was Distinguished Lecturer of the IEEE CAS Society (2001-2002) and later chaired the IEEE Technical Committee Cellular Neural Networks & Array Computing. He sits on the editorial boards of and works as a reviewer for several journals. He is a member of the scientific committee of and chaired several international conferences. Prof. Tetzlaff also works as a reviewer for the European Commission and is a member of the Informationstechnische Gesellschaft (ITG), the German Society of Electrical Engineers, and of the German URSI Committee. His scientific interests include problems in the theory of signals and systems, system modelling, and machine learning, among others.